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東京精密TSK探針臺

TSK全自動探針臺 UF190R /UF200R|東京精密ACCRETECH探針臺

適合測試分立器件的200mm探針臺。開環(huán)系統(tǒng)和輕量化的Z軸系統(tǒng)，實現(xiàn)了更高的生產(chǎn)效率

產(chǎn)品概述

產(chǎn)品規(guī)格表

外形尺寸

特點：

高效率、高吞吐量。擁有更高的性價比

UF200和UF190完全兼容，比如公認(rèn)的自動探針對齊。功能和全彩觸摸面板。

UF200R

Wafer Size φ5",φ6",08
X-Y axis	Probing Maximum		Area Speed	±120mm(Each XY axis A probe area) 300mm/s
Z axis	Probing Maximum		Area Speed	69mm 30mm/s
θ axis Rotation Speed +5 deg
Fine Alignment CCD ITV Image Processing
Loader	Casselte Mounts Wafer Handling			1(2nd cassette with option) Robot Arm /Backside Holding
Hard Disk 20GB or more
USB Interface nemory (Tokyo Seimitsu 's recommendation
Display 12.1"TFT Color LCD
Power Consumption AC100V±10V 50/60Hz Approximately 1.3kVA (Hot Chuck)
Air Pressure		Source Pressure Consumption		0.4MPa or more Approximately 0.18/1 wafer(Average
Vacuum Supply Less than-53kPa,30f/min or more
Dimensior	1092*×1115? ×8871mm with card automatic exchange option:933mm
Weight 800kg(Standard)

Test HeadConmechonJg(UF2008only

HotChuck

Of-Site Inking

NeedeCleanng

Adstional Loader

GP-IB Interface

X-Y Coordnate Interface

Neede Mark Inspection

Fai MakInspection

CategoryInterface

Water ID Reading

65~2048 Stes Paralei Tesing

AutonatcPobe CandEatangr(UF200R ory)

Printer

Joystick

Adisplacementsensor

UF190R

Overall Accuracy Within ±10μm
Wafer Size φ4、φ5”、q6°、φ8”
X-Y axis	Probing Area Maximum Speed	±120mm(Each XY axis A probe area) 300mml5
Z axis M(P)a(r)x(o)i(b)m(i)u(n)m(g) S(A)p(r)e(e)e(a)c 30mm(37mm)/s
B axis Rotation Spee ±5 deg Fine Alignmen CCD ITV Image Processing
Loader	Cassette Mounts Wafer Handling	1(2nd Robot	cassette with option) Arm/Backside Holding
Hard Disk 20GB or more
USB Interface USB memory (Tokyo Seimitsu's recommendation)
Display 12.1"TFT Color LCD
Power Consumption Air Pressure Source Pressure		AC100V±10V 50/60Hz Approximately 1.3kVA(Hot Chuck) 0.4MPa or more
ConsumptionApproximately 0.1t/1 wafer (Average)Vacuum SupplyLess than -53kPa,30t/minor more
Dimension 1092*×1115D×887Hmm
Weight 800kg(Standard)

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